Industry Directory: nsulated metal substrate pcb's (9)

MEC Company Ltd.

Industry Directory | Manufacturer

R&D, production and sales of chemicals, equipment and related materials used in the production of PCB

HAODA ELECTRONIC CO.,LIMITED

Industry Directory | Manufacturer

HAODA ELECTRONIC CO.,LIMITED specializes in high-speed turn-key PCB services:PCB design, PCB Fabrication, PCBA and Components Sourcing, we provide services for about 4000 customers around the world.

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New SMT Equipment: nsulated metal substrate pcb's (20)

Alumimum PCB

Alumimum PCB

New Equipment | Fabrication Services

PCBONLINE provides aluminum PCB manufacturing and assembly for industrial high-power cooling, automotive headlights, power boards, etc. The complexity of the design may require double or even multiple layers, including HDI structures. If your current

PCBONLINE

Ceramic Circuit Board With LED Heat Dissipation

Ceramic Circuit Board With LED Heat Dissipation

New Equipment | IC Packaging

Owing to the our immense experience and understanding in this particular market, we are Manufacturing and Supplying an excellent variety of Ceramic Circuit Board With Led Heat Dissipation And Long Service Life from Wuhan, Hubei, China. High bonding s

Folysky Technology(Wuhan)Co.,Ltd

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Electronics Forum: nsulated metal substrate pcb's (24)

lead substrate materials

Electronics Forum | Wed Jan 30 09:10:48 EST 2002 | bob_smith

Hi Dave, Sorry about that. Specifically, I am referring to radial leads on a crystal. The leads are supposed to be gold plated but only 1/2 to 2/3 of the lead is plated. We bend the lead to form a foot which is soldered to a pad on the PCB. Normally

Skewed components

Electronics Forum | Thu Mar 08 15:21:43 EST 2007 | pima

To be honest this product its only a part of bigger PCB, so we have only substrate with 3 FETs on it so no other components at substrate occurs and all substrate are staying at metal fixture. WE have already window pan aperture. WE producing this pro

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Used SMT Equipment: nsulated metal substrate pcb's (2)

Ekra X5

Ekra X5

Used SMT Equipment | Screen Printers

Ekra   Type model – X5 Serial-Number – X5 01089 Alignment Repeatability -  +12.5 µm@6sigma Printing speed -  9mm/sec to 200mm/sec Printing pressure – 0kg to 26kg Frame size – 736mm*736mm*38mm Pr

Ekloo Bis

Yamaha YPS

Yamaha YPS

Used SMT Equipment | Screen Printers

Yamaha YSP Screen printer in excellent condition.Vintage: 2016FeaturesYamaha’s original 3S headAutomatically adjusts squeegee angle (1 degreeunits between 45 to 65 degrees) and speed tooptimize settings for best print results with selectedsolder-past

Fix Trade BV

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Industry News: nsulated metal substrate pcb's (63)

Global PCB Industry Grew 2.4 Percent in 2011 According to IPC World PCB Production Report

Industry News | 2012-10-05 16:44:21.0

y IPC — Association Connecting Electronics Industries®. Published annually, the report offers consensus estimates of PCB production value by country and by product category, and analysis of global and regional PCB industry trends

Association Connecting Electronics Industries (IPC)

World PCB Market Grew 1.7 Percent in 2012 According to IPC World PCB Production Report

Industry News | 2013-09-17 07:21:08.0

The world market for PCBs reached nearly $60 billion in 2012, with 1.7 percent real growth over 2011, according to IPC’s World PCB Production Report for the Year 2012.

Association Connecting Electronics Industries (IPC)

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Technical Library: nsulated metal substrate pcb's (4)

Factors Affecting the Adhesion of Thin Film Copper on Polyimide

Technical Library | 2017-11-22 12:38:51.0

The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.

Intrinsiq Materials Inc.

Surface Treatment Enabling Low Temperature Soldering to Aluminum

Technical Library | 2020-07-29 19:58:48.0

The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low cost LED lighting and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits. Aluminum is not easy to solder components to at low temperatures and PET cannot withstand high temperatures. Soldering to these materials requires either an additional surface treatment or the use of conductive epoxy to attach components. Surface treatment of aluminum includes the likes of Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet-chemistry and cost-prohibitive for mass adoption. Conductive adhesives, including Anisotropic Conductive Paste (ACP), are another alternate to soldering components. These result in component substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented that addresses all these constraints. Once applied on Aluminum surfaces using conventional printing techniques such as screen, stencil, etc., it is cured thermally in a convection oven at low temperatures. This surface treatment is non-conductive. To attach a component, a solder bump on the component or solder printed on the treated pad is needed before placing the component. The Aluminum circuit will pass through a reflow oven, as is commonly done in PCB manufacturing. This allows for the formation of a true metal to metal bond between the solder and the aluminum on the pads. This process paves the way for large scale, low cost manufacturing of Al-PET circuits. We will also discuss details of the process used to make functional aluminum circuits, study the resultant solder-aluminum bond, shear results and SEM/ EDS analysis.

Averatek Corporation

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Videos: nsulated metal substrate pcb's (5)

I.C.T Lyra Series Reflow Oven with CBS Function

I.C.T Lyra Series Reflow Oven with CBS Function

Videos

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board

Dongguan Intercontinental Technology Co., Ltd.

Pneumatic Linear PCB Separator MDS-620

Pneumatic Linear PCB Separator MDS-620

Videos

MDS-620 cuts flexible and ultra-thin PCBs clean, with no ripping or tearing, the linear rather than circular, cutting surfaces allow for faster separations without added stress. To get more information from below link: http://www.1clicksmt.com/produ

1ClickSMT Technology Co., Ltd.

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Career Center - Resumes: nsulated metal substrate pcb's (1)

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

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Express Newsletter: nsulated metal substrate pcb's (925)

SMTnet Express - October 15, 2015

SMTnet Express, October 15, 2015, Subscribers: 23,684, Members: Companies: 14,684, Users: 39,145 Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication Dave Sommervold, Chris Parker, Steve

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